Gel-Film series products

Gel-Film is made of patented Gel/Vertec material, covering three models: WF/WF-A/WPV/WPV-A, PF/PPV and DGL.

It uses a thin substrate and a special thermal conductive layer to withstand temperatures from -40 to 220 degrees Celsius.
High shear stress and vertical adhesion, and low transverse tear force, allow for easy component removal.
Suitable for evaporation, sputtering and other processes, effectively solving the problems of shielding and residual glue caused by traditional fixtures.
No gas will be released, ensuring cleanliness in high temperature and low pressure environment.
It can be applied to wafer scribing and wire breaking processes to prevent interference from debris.
Provide standard sizes and customized cutting options to meet different process requirements.

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