The patented design is suitable for fragile products of all sizes and can be used with automatic machines. The product is "safely released" through vacuum suction, which improves the working efficiency and reduces the risk of damage. It is especially suitable for the process that requires accurate access to Known Good Die. Compared with other traditional carriers, it has the advantages of durable storage, no residual glue and reusable.

Suitable for：

• High-yield, automated Pick & Place process
• Handling and storage of bare die
• Sensitive applications that touch the top surface or edge of the component need to be avoided.

Subseries products：

• VR/VRP Tray series：Suitable for components with X and Y axis sizes from less than 250 microns to 75 mm.
• VRLF/VRPLF series：It is suitable for diced wafers on film frames and processing extremely thin and high-value substrates, such as InP, GaAs, AFM and MEMS wafers.
• NDT/NDTVP series：Suitable for extremely small size components (250 m× 250 m or less)