Bourns today announced the SRP2008DP Series, its new line of high current shielded power inductors designed for high current applications that need to push the limits of board-space efficiency. Constructed with a metal-alloy powder core and packaged in a low-profile 0.8 mm footprint, the SRP2008DP Series delivers the saturation current capacity that power dense DC-DC converter designs demand—without the design layout penalties that typically accompany such performance.

Because power density requirements have continued to climb across consumer electronics, IoT devices and smaller industrial equipment, designers face a persistent tradeoff between inductor performance and physical size. Radiated emissions and signal integrity are growing concerns in these crowded layouts, where interference between adjacent components can undermine system reliability and complicate EMC compliance. Shielded magnetics help manage these risks, but shielded components have historically occupied more board real estate than unshielded alternatives. The SRP2008DP Series’ metal-alloy powder core design and compact size addresses these challenges directly.

“As electronic systems grow more sophisticated while shrinking in size, the components inside them have to keep pace. The Bourns® SRP2008DP Series gives engineers all the safety, signal integrity and compliance benefits of a shielded, high-current inductor in a footprint that doesn’t compromise their layout.”