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Bourns Releases LTCC Low Pass Filters for Wireless Communication Applications Covering DC to 3800 MHz

 Bourns today announced the release of the Model FLP1004N089D4, FLP1606N078D6, FLP1606N355D6, FLP1608N250D6,FLP2009N025D8,FLP2009N086D8,FLP2009N091D8,FLP2009N092D8, and FLP2009N141L3 LTCC (low-temperature co-fired ceramic) low pass filters, a family of nine models designed to address size constraints and frequency-selective filtering requirements in wireless communication designs. Utilizing LTCC multilayer ceramic construction, the FLP Series integrates passive elements into compact monolithic components that support operating frequencies ranging from DC to 3800 MHz while maintaining operation over a temperature range of -40 °C to +85 °C.

As wireless communication equipment continues to span multiple frequency bands and application environments, designers are often challenged to reduce circuit size without sacrificing filtering performance. Integrating multiple passive elements into a single LTCC structure helps minimize board space requirements while simplifying RF circuit layouts. The FLP Series addresses these requirements with multiple package sizes and frequency ranges that support sub-GHz IoT devices, LTE infrastructure and terminals, GNSS applications, and 5G systems. The compact monolithic construction also provides a reliable approach for microelectronic wireless communication designs operating across varying environmental conditions.

“Wireless equipment designers often need filtering components that support specific frequency bands while minimizing PCB area consumption,” said Edward Liu, Product Line Manager, Bourns. “The FLP Series combines LTCC multilayer construction with coverage from DC to 3800 MHz, giving engineers multiple filter options for IoT, LTE, GNSS and 5G applications while maintaining compact package dimensions and operation from -40 °C to +85 °C.”

 

Design Features and Key Capabilities

  • Low-temperature co-fired ceramic (LTCC) multilayer ceramic construction — integrates passive elements into a single monolithic structure, helping reduce component count and board space
  • Compact form factors across multiple package sizes — supports space-constrained wireless communication designs
  • Working frequency ranges from DC to 3800 MHz — covers multiple wireless communication frequency bands with model-specific filtering characteristics
  • RoHS compliant* - Meets global environmental regulations

 

Electrical Specifications

Model Size Frequency Range Max. Insertion Loss @ +25 °C Operating Temperature
FLP1004N089D4 1.0 x 0.5 x 0.4 824 - 960 MHz 0.70 dB -40 °C to +85 °C
FLP1606N078D6 1.6 x 0.8 x 0.6 600 - 960 MHz 0.60 dB - 0.70 dB -40 °C to +85 °C
FLP1606N355D6 1.6 x 0.8 x 0.6 3300 - 3800 MHz 0.60 dB -40 °C to +85 °C
FLP1608N250D6 1.6 x 0.8 x 0.6 2300 - 2700 MHz 0.55 dB -40 °C to +85 °C
FLP2009N025D8 2.0 x 1.25 x 0.95 DC - 500 MHz 0.70 dB -40 °C to +85 °C
FLP2009N086D8 2.0 x 1.25 x 0.95 858- 878 MHz 0.50 dB -40 °C to +85 °C
FLP2009N091D8 2.0 x 1.25 x 0.95 863 - 960 MHz 0.70 dB -40 °C to +85 °C
FLP2009N092D8 2.0 x 1.25 x 0.95 902 - 928 MHz 0.60 dB -40 °C to +85 °C
FLP2009N141L3 2.0 x 1.25 x 0.9 800 - 2025 MHz 0.50 dB - 1.50 dB -40 °C to +85 °C

 

Applications

  • IoT devices (FLP1004N089D4, FLP1606N078D6, FLP2009N086D8, FLP2009N092D8, FLP2009N091D8, FLP2009N025D8 and FLP2009N141L3) — supports wireless connectivity and communication functions in compact connected devices
  • GNSS applications (FLP2009N141L3) — provides filtering for satellite-based positioning and navigation receivers
  • 5G systems (FLP1606N355D6) — supports filtering requirements in 5G frequency bands from 3300 MHz to 3800 MHz
  • LTE infrastructure and devices (FLP1608N250D6) — intended for LTE network equipment and wireless communication devices

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