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Bourns Releases LTCC Band Pass Filters for 5G C-Band RF Front-End Designs

Bourns today announced the Model FBP1604N470L3,  FBP1608N375L3, and FBP2007N470L3 LTCC (Low-Temperature Co-fired Ceramic) band pass filters. These multilayer ceramic RF components are designed for high-frequency applications operating across frequency ranges from 3300 MHz to 5000 MHz and support deployment within the 5G C-band spectrum. By integrating multiple passive elements into a single monolithic structure, the filters provide compact component options for RF front-end designs where board space and frequency coverage are primary design considerations.

RF front-end designs for 5G equipment require filtering components that fit into compact layouts while maintaining defined frequency response and insertion loss limits. LTCC technology integrates passive elements into a ceramic multilayer structure, supporting slim, compact, and reliable microelectronic designs. The three FBP models cover 3300 MHz to 4200 MHz and 4400 MHz to 5000 MHz frequency ranges, with maximum insertion loss ratings from 0.9 dB to 1.7 dB at +25 °C depending on the model. The products support operating temperatures from -40 °C to +85 °C, with the FBP2007N470L3 model specified from -40 °C to +105 °C.

“RF front-end designers selecting filters for 5G designs need frequency coverage, compact package dimensions, and insertion loss values that can be checked directly against the circuit requirements. The FBP Series LTCC Band Pass Filters combine multilayer ceramic construction with frequency ranges across 3300 MHz to 5000 MHz and compact package sizes down to 1.6 x 0.8 x 0.35 mm. These specifications give designers a documented filter option for eMBB, Fixed Wireless Access, and private 5G network deployments.” — Edward Liu, Product Line Manager, Bourns.

Design Features and Key Capabilities

  • Low-Temperature Co-fired Ceramic (LTCC) — integrates multiple passive elements into a single monolithic ceramic structure to support compact microelectronic designs
  • Compact size — supports board layouts requiring small RF components, with package sizes of 1.6 x 0.8 x 0.35 mm, 1.6 x 0.8 x 0.4 mm, and 2.0 x 1.25 x 0.65 mm
  • RoHS compliant* — meets the RoHS compliance statement listed in the product data sheets

 

Electrical Specifications (TA = 25 °C)

Model Size (mm) Frequency Range Maximum Insertion Loss @ +25 °C Operating Temperature
FBP1604N470L3 1.6 x 0.8 x 0.4 4400 MHz - 5000 MHz 1.5 dB max. -40 °C to +85 °C
FBP1608N375L3 1.6 x 0.8 x 0.35 3300 MHz - 4200 MHz 1.7 dB max. -40 °C to +85 °C
FBP2007N470L3 2.0 x 1.25 x 0.65 4400 MHz - 5000 MHz 0.9 dB max. -40 °C to +105 °C

 

Applications

  • 5G C-band RF front-end designs — supporting enhanced mobile broadband (eMBB), Fixed Wireless Access (FWA), and private 5G network deployments

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