With the rapid growth in AI computing demands, Co-Packaged Optics (CPO) has emerged as a key technological direction for next-generation high-speed data transmission. The Optical Engine, Photonic Integrated Circuit (PIC), Laser Die, and various high-value optoelectronic components used in CPO manufacturing processes impose stringent requirements on cleanliness, particle control, and handling protection.

Gel-Pak provides a complete Carrier Solution for CPO industry, including VR Tray, BTXF Tray, Gel-Pak Film, Wafer Carrier and Custom Packaging Solutions, which can cover key processes such as wafer manufacturing, optical component assembly, packaging, testing and final transportation.Among them, VR Tray is especially suitable for long-distance transportation and cross-factory logistics, which can effectively reduce the risk of displacement and damage of high-value photoelectric components during transportation; BTXF Tray is suitable for in-plant process flow and automatic production line applications, and its low contact surface design can effectively reduce the risk of Particle transfer and product pollution, while supporting high-precision Pick & Place operations.

With years of experience in semiconductor, optical communication and advanced packaging industries, Gel-Pak can help CPO customers improve product yield, reduce process risks, and establish a complete vehicle and transportation solution that meets the needs of high-speed optoelectronic packaging in the future.

Target Applications

• CPO (Common Package Optics)
• Silicon Photonics (SiPh)
• Optical Engine
• PIC (Photonic Integrated Circuit)
•  Laser Mold 
• Optical Transceiver
• Advanced Packaging 
• Artificial Intelligence and High Speed Computing Devices

Key Benefits

•  Low Particle Generation 
•  Minimal Device Contact Area
• Superior Transportation Protection
• Automation-Friendly Design
• Customized Carrier Solutions

• Supports Advanced Packaging and Optical Components